Sputtering System HV/ UHV
RF/ DC/ Multi-tech
- Cylindrical or parallelepipedal chambers, with front door or top
lid
- Standard chambers: 350, 400, 450, 600, 900 mm in diameter
- Single wafer or cassette load-lock
- Rectangular or circular DC and RF cathodes
- Sputter up/ down configurations
- Clusters for confocal systems, true co-sputtering
- Reactive and non-reactive sputtering
- Static or dynamic deposition, Planetary and double planetary
rotation, Oscillation
- RF bias on substrates prior to and during deposition
- Substrate temperature up to 1000°C
Application
- Monolayers
- Multilayers
- Magnetic layers
- Optical layers
